Seen as a means to drive economic growth and create jobs, Horizon 2020 has the political backing of Europe’s leaders and the Members of the European Parliament. They agreed that research is an investment in our future and so put it at the heart of the EU’s blueprint for smart, sustainable and inclusive growth and jobs.
By coupling research and innovation, Horizon 2020 is helping to achieve this with its emphasis on excellent science, industrial leadership and tackling societal challenges. The goal is to ensure Europe produces world-class science, removes barriers to innovation and makes it easier for the public and private sectors to work together in delivering innovation.
Horizon 2020 is open to everyone, with a simple structure that reduces red tape and time so participants can focus on what is really important. This approach makes sure new projects get off the ground quickly – and achieve results faster.
The EU Framework Programme for Research and Innovation will be complemented by further measures to complete and further develop the European Research Area. These measures will aim at breaking down barriers to create a genuine single market for knowledge, research and innovation.
Generic micro- and nano-electronic technologies
CONNECT has been funded with four milion euros over three years under the H2020 call ICT-25-2015 specifically dedicated to micro- and nano-electronic technologies.
Specific Challenge: The objective is to keep Europe's position at the forefront of advanced micro- and nano-electronic technologies developments. This is essential to maintain Europe's global position in the area and to ensure strategic electronic design and manufacturing capability in Europe avoiding dependencies from other regions. Advanced micro- and nano-electronics technologies enable innovative solutions to societal challenges.
Scope: The focus will be on the grand technological challenges in information processing and communications based on memory and logic devices, circuits and architectures for advanced CMOS technologies. It will also be on the exploration of new alternative information processing devices and microarchitectures for existing or new functions. The objective is to sustain the historical integrated circuit scaling cadence and reduction of cost/function into future decades.
a. Research & Innovation Actions
· Extending MOSFET to the end of the ITRS roadmap and making "Beyond and Extended CMOS" devices compatible with CMOS (integration, systemability and manufacturability). Focus will be on high mobility substrates for performance improvement, new switch architectures for reduced energy dissipation, 3D approaches, new information carriers, emerging memory devices and on interconnecting nanoscale objects and novel interconnect architectures. The projects may include activities related to modelling and simulation: e.g. quantum and atomic scale effects. Exploratory research on Graphene devices will be handled under the Graphene Flagship and therefore not included under this objective.
· Integration of functionalities in a system-on-chip (SoC) or system-in-package (SiP) by using nanostructures and/or nanodevices.
· New computing paradigms like quantum computing and neuromorphic computing with a focus on their future integration with Si technologies.
· Design for advanced nanoelectronics technologies. Focus will be on design-technology solutions for energy efficiency, high reliability and robustness.
b. Innovation Actions targeted to provide access for academia, research institutes and SMEs to advanced design tools and IC fabrication, including access to technology platforms for piloting small series of advanced products. Actions should include training. Assessment for technology suppliers in nano-electronics to evaluate novel equipment, processes and building blocks with potential customers, including tools and methods for metrology and characterisation. This last area is open to international cooperation.
c. Coordination and support actions
· International cooperation with USA and Asia in the areas of standardisation including in manufacturing (450 mm wafers); improved assessment of the potential impact on workers of the manipulation of nano-materials in the semiconductor fabrication process.
· Development of common roadmaps; early technology benchmark/identification on promising novel technologies.
· Awareness actions targeted at young students.
· Regain market shares of the European electronic sector and reverse the declining EU market share in electronic components. Maintain the European manufacturing base and prepare the industry for future developments of the electronic landscape.
· At the economic level, secure the availability of essential parts in the value chain in Europe to design and manufacture innovative electronic components and systems.
· At technological level, sustain the historical integrated circuit scaling cadence and reduction of cost/function and strengthen the interaction between design and technology development; continue to increase the number of devices per mm2, with minimum features approaching 10 nanometers or per mm3 by developing 3D approaches, to maintain the industry pace of a doubling of transistor density every 18 months.
· At innovation level, facilitate the easy access to design tools and advanced IC manufacturing for academia, research institutes and SMEs, and for European equipment industry to validate their innovative equipment.
· Improved coordination in identified areas. Ensure that young people understand the fundamental nature and the importance of micro and nano-electronics technology for our future and want to work in this area.
Types of action:
a. Research & Innovation Actions – Proposals requesting a Small contribution are expected
b. Innovation Actions – Proposals requesting a Small contribution are expected
c. Coordination and Support Actions